T2M Semi’s Wi-Fi 7 + BLE Audio SoCs deliver ultra-fast, low-power, and reliable wireless connectivity for next-gen smart and IoT devices.
The world of wireless is changing at a rapid rate. The need to have seamless, high-speed, and energy-efficient connectivity has become an inflection point in terms of smart homes and industrial Internet of Things, connected cars, and immersive entertainment.
With Wi-Fi 6 going mainstream, current attention is on Wi-Fi 7, which is a new standard in wireless performance and how it can be integrated with BLE Audio to achieve advanced, low-power communication.
First in this evolution is T2M Semi, which is offering next-generation Wi-Fi 7 + BLE Audio SoCs that are set to transform the manner in which devices connect, communicate, and cooperate.
The technology of Wi-Fi 7 (IEEE 802.11be) is a significant breakthrough in wireless technology. Wi-Fi 7 provides incredibly fast speeds of up to 4x higher than Wi-Fi 6 with 320 MHz channel bandwidth, 4096-QAM modulation, and Multi-Link Operation (MLO), and with low latency and improved stability.
T2M Semi Wi-Fi 7 SoCs are specifically optimized to operate in areas where performance, range, and reliability come together – allowing immersive 8K streaming, AR / VR interaction, real-time edge computing, and responsive, ultra-responsive IoT ecosystems.
As Wi-Fi 7 handles applications that require high bandwidth, BLE Audio accommodates the surging demand for energy-efficient, high-fidelity wireless audio.
The T2M Semi-integrated BLE Audio stack supports LC3 codec, multi-stream audio, and broadcast audio — so audio can be easily synchronized, and it introduces low-latency audio to multiple devices, such as True Wireless Stereo earbuds, wearables, smart TVs, or infotainment.
With Wi-Fi 7 and BLE audio together, developers can create devices that stream faster, sound better, and last longer – without sacrificing power consumption or coexistence of signals.
T2M Semi Wi-Fi 7 + BLE Audio System on Chips (SoCs) are designed to meet the performance needs of emerging technologies in a variety of areas:
From 8K streaming and gaming consoles to voice assistants based on AI, T2M Semi SoCs deliver connectivity without interference at faster speeds, while joining multiple devices together seamlessly.
Reliable, in-vehicle infotainment, wireless diagnostics, and driver-assist systems with low-latency connectivity, as well as BLE Audio, even on the move.
Low-latency Wi-Fi 7 connectivity in smart factories offers real-time communications and predictive analytics with improved security to automation systems, sensors, and robots.
With high throughput and low latency, Wi-Fi 7 + BLE SoCs facilitate edge AI applications, AR/VR headsets, and next-generation smart devices that need both performance and efficiency.
Power efficiency is a prime concern in every project of T2M Semi. All SoCs offer intelligent power domains, dynamic frequency scaling, and RF optimizations that yield high performance per milliwatt — with minimized total system power consumption and responsiveness. This translates into a scalable platform that is employed across applications varying from small wearables to high-performance consumer and industrial devices.
As more and more devices remain online, security-by-design is no longer a choice. T2M Semi SoCs offer AES encryption, secure boot, and hardware authentication to provide a secure, trust-based connection throughout IoT and enterprise ecosystems.
All will also enable future standards like Matter, Thread, and CSA frameworks, with seamless interoperability and future-proof scalability for OEMs and developers.
Beyond silicon innovation, T2M Semi empowers developers and manufacturers with a comprehensive software and hardware ecosystem.
Each Wi-Fi 7 + BLE Audio SoC comes with:
Complete SDKs and API toolchains for easy integration into existing systems.
RF tuning and calibration tools that ensure consistent wireless performance across environments.
Firmware stacks and reference designs that reduce development time and accelerate go-to-market cycles.
Cross-platform development support, enabling teams to prototype faster across multiple OS environments.
T2M Semi also offers custom firmware services and co-development support, allowing partners to tailor power profiles, security policies, and feature sets to their exact application needs.
This holistic approach means OEMs and developers can innovate confidently, reduce design complexity, and achieve product readiness in record time — whether building the next-gen wearable, industrial gateway, or immersive consumer product.
In a world where time-to-market defines competitiveness, T2M Semi’s developer-first philosophy ensures that engineering teams spend less time solving integration challenges and more time creating differentiated user experiences.
Outside of silicon, T2M Semi provides a complete ecosystem solution that includes SDKs, firmware stacks, RF calibration tools, and technical design support. It is this end-to-end process that enables device makers to get new products to market more quickly, manage the difficult integration burdens, and provide a faster time to market. Program partners have what they need to innovate with confidence, whether creating an industrial gateway, next-generation wearable, or next-generation smart displays.
As wireless is evolving, Wi-Fi 7 + BLE Audio SoCs are the future generation of connected experiences-faster, cost-effective, and smarter.
T2M Semi’s SoC platforms take this generation of highly connected experience to the next level with a platform that personifies this evolution into the architecture of our future experiences; smarter, faster, and extensively connected experiences.
At T2M Semi, we continue to drive innovation while empowering the world to transition to high-performance and energy-efficient wireless environments that will make the promise of a connected world possible.
